| ชื่อเรื่อง | : | Impacts of bends and ground return vias on interconnects for high speed GHz designs |
| นักวิจัย | : | Chang, Richard Weng Yew , See, Kye Yak , Tan, Yang Long |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2551 |
| อ้างอิง | : | Chang, R. W. Y., See, K. Y., & Tan, Y. L. (2008). Impacts of bends and ground return vias on interconnects for high speed GHz designs. In proceedings of the Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility: Singapore, (pp.502-505). , http://hdl.handle.net/10220/6386 , http://dx.doi.org/10.1109/APEMC.2008.4559922 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | In the past only critical clock circuits are running at high speed but this is no longer true in today high-speed digital design world. Most of the digital traces on board are running at speed in excess of 200 MHz and drivers output with rise time less than 1 ns. Due to constraints of board size and highly complex designs, trace bends and inter-layer transitions through vias are unavoidable. This paper carries out a comprehensive study on the impacts of bends and ground return vias optimisation on signal integrity performance using a full-wave electromagnetic simulator. (CST Microwave Studio). This study will provide high-speed digital designers an in-depth assessment of these effects in high-speed GHz applications so that some design guides to avoid these effects can be established. |
| บรรณานุกรม | : |
Chang, Richard Weng Yew , See, Kye Yak , Tan, Yang Long . (2551). Impacts of bends and ground return vias on interconnects for high speed GHz designs.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Chang, Richard Weng Yew , See, Kye Yak , Tan, Yang Long . 2551. "Impacts of bends and ground return vias on interconnects for high speed GHz designs".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Chang, Richard Weng Yew , See, Kye Yak , Tan, Yang Long . "Impacts of bends and ground return vias on interconnects for high speed GHz designs."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2551. Print. Chang, Richard Weng Yew , See, Kye Yak , Tan, Yang Long . Impacts of bends and ground return vias on interconnects for high speed GHz designs. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2551.
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