| ชื่อเรื่อง | : | AlN-AlN wafer bonding and its thermal characteristics |
| นักวิจัย | : | Bao, Shunyu , Lee, Kwang Hong , Chong, Gang Yih , Fitzgerald, Eugene A , Tan, Chuan Seng |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering::Electric power::Auxiliaries, applications and electric industries |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2557 |
| อ้างอิง | : | Bao, S., Lee, K. H., Chong, G. Y., Fitzgerald, E. A., & Tan, C. S. (2014). AlN-AlN wafer bonding and its thermal characteristics. ECS transactions, 64(5), 141-148. , 1938-5862 , http://hdl.handle.net/10220/25056 , http://dx.doi.org/10.1149/06405.0141ecst |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | ECS transactions |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Homogeneous bonding was successfully demonstrated on 150 mm Si wafers by face-to-face fusion bonding of two clean and smooth aluminum nitride (AlN) layers. Characterization result from XPS confirms the layer composition and reveals that approximately 5 nm of the layer surface was partially oxidized during processing. The as-bonded wafer pair is nearly void and particle free with a high bonding strength of 1263.0 mJ/m2, enabling it to withstand the subsequent process steps. In addition, the AlN-AlN bonded wafers appear to have the best heat dissipation capability when compared with other bonded wafers, which used SiO2 or Al2O3 as the bonding layer. |
| บรรณานุกรม | : |
Bao, Shunyu , Lee, Kwang Hong , Chong, Gang Yih , Fitzgerald, Eugene A , Tan, Chuan Seng . (2557). AlN-AlN wafer bonding and its thermal characteristics.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Bao, Shunyu , Lee, Kwang Hong , Chong, Gang Yih , Fitzgerald, Eugene A , Tan, Chuan Seng . 2557. "AlN-AlN wafer bonding and its thermal characteristics".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Bao, Shunyu , Lee, Kwang Hong , Chong, Gang Yih , Fitzgerald, Eugene A , Tan, Chuan Seng . "AlN-AlN wafer bonding and its thermal characteristics."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2557. Print. Bao, Shunyu , Lee, Kwang Hong , Chong, Gang Yih , Fitzgerald, Eugene A , Tan, Chuan Seng . AlN-AlN wafer bonding and its thermal characteristics. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2557.
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