| ชื่อเรื่อง | : | Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation |
| นักวิจัย | : | Lim, Dau Fatt , Fan, Ji , Peng, L. , Leong, K. C. , Tan, Chuan Seng |
| คำค้น | : | DRNTU::Engineering::Materials::Electronic packaging materials. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2556 |
| อ้างอิง | : | Lim, D. F., Fan, J., Peng, L., Leong, K. C., & Tan, C. S. (2013). Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation. Journal of electronic materials, 42(3), 502-506. , http://hdl.handle.net/10220/18163 , http://dx.doi.org/10.1007/s11664-012-2353-6 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Journal of electronic materials |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Low-temperature Cu–Cu thermocompression bonding enabled by self-assembled monolayer (SAM) passivation for hermetic sealing application is investigated in this work. Cavities are etched to a volume of 1.4 × 10−3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging. The wafer pairs (nonfunctional cavity wafer and cap wafer) are annealed and bonded at 250°C under a bonding force of 5500 N. The encapsulated cavities undergo helium overpressure in a bombing chamber, and the helium leak rate is detected by a mass spectrometer. The measurement results show that the cavities sealed with Cu–Cu bonding after SAM passivation exhibit excellent hermeticity with a leak rate below 10−9 atm cm3/s, which is an improvement of at least 2× compared with the control sample without SAM passivation. |
| บรรณานุกรม | : |
Lim, Dau Fatt , Fan, Ji , Peng, L. , Leong, K. C. , Tan, Chuan Seng . (2556). Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Lim, Dau Fatt , Fan, Ji , Peng, L. , Leong, K. C. , Tan, Chuan Seng . 2556. "Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Lim, Dau Fatt , Fan, Ji , Peng, L. , Leong, K. C. , Tan, Chuan Seng . "Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2556. Print. Lim, Dau Fatt , Fan, Ji , Peng, L. , Leong, K. C. , Tan, Chuan Seng . Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2556.
|
ridm@nrct.go.th ระบบคลังข้อมูลงานวิจัยไทย รายการโปรดที่คุณเลือกไว้
