| ชื่อเรื่อง | : | Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds |
| นักวิจัย | : | Tan, Chuan Seng , Peng, Lan , Fan, Ji , Li, Hong Yu , Gao, Shan |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2555 |
| อ้างอิง | : | Tan, C. S., Peng, L., Fan, J., Li, H., & Gao, S. (2012). Three-Dimensional Wafer Stacking Using Cu–Cu Bonding for Simultaneous Formation of Electrical, Mechanical, and Hermetic Bonds. IEEE Transactions on Device and Materials Reliability, 12(2), 194-200. , http://hdl.handle.net/10220/16479 , http://dx.doi.org/10.1109/TDMR.2012.2188802 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | IEEE transactions on device and materials reliability |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Wafer-on-wafer stacking is demonstrated successfully using bumpless Cu-Cu bonding for the simultaneous formation of electrical connection, mechanical support, and hermetic frame for 3-D IC application. The ohmic behavior of the Cu-Cu bond is verified. A daisy chain of at least 44 000 contacts at a 15-μm pitch is connected successfully and sustains thermal cycling. Postbonding delamination is found to be strongly affected by the wafer curvature and bond strength. The Cu-Cu hermetic seal ring shows a helium leak rate more than ten times lower than the reject limit (5 × 10-8 atm · cm/s based on MIL-STD-883E standard) without underfill. This provides a robust IC-to-IC connection density of 4.4 × 105 cm-2, suitable for future wafer-level 3-D integration. |
| บรรณานุกรม | : |
Tan, Chuan Seng , Peng, Lan , Fan, Ji , Li, Hong Yu , Gao, Shan . (2555). Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Chuan Seng , Peng, Lan , Fan, Ji , Li, Hong Yu , Gao, Shan . 2555. "Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Chuan Seng , Peng, Lan , Fan, Ji , Li, Hong Yu , Gao, Shan . "Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2555. Print. Tan, Chuan Seng , Peng, Lan , Fan, Ji , Li, Hong Yu , Gao, Shan . Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2555.
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