| ชื่อเรื่อง | : | Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief |
| นักวิจัย | : | Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2555 |
| อ้างอิง | : | Ghosh, K., Zhang, J., Zhang, L., Dong, Y., Li, H., Tan, C. M., Xia, G.,& Tan, C. S. (2012). Integration of Low-κ Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief. Applied Physics Express, 5(12), 126601-. , http://hdl.handle.net/10220/12600 , http://dx.doi.org/10.1143/APEX.5.126601 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Applied physics express |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Through silicon via (TSV) consists of a copper (Cu) core isolated by a dielectric liner. The thermomechanical stress originating from the mismatch in the coefficient of thermal expansion of Cu and silicon is a serious concern on mechanical reliability and electrical variability. The effect on thermomechanical stress by replacing the conventional liner (silicon dioxide) with a low-κ liner (carbon-doped silicon dioxide) is studied. By micro-Raman analysis, it is observed that the biaxial stress in silicon at the immediate vicinity of Cu-TSV is relieved by 29–45% with a low-κ liner due to its smaller elastic modulus. |
| บรรณานุกรม | : |
Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . (2555). Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . 2555. "Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . "Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2555. Print. Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2555.
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