| ชื่อเรื่อง | : | Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement |
| นักวิจัย | : | Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2554 |
| อ้างอิง | : | http://hdl.handle.net/10220/11241 , http://dx.doi.org/10.1016/j.microrel.2011.04.003 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Microelectronics reliability |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during storage in the room ambient. After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in inert ambient to uncover the clean Cu surface. A pair of wafers is bonded at 250 °C. Clear evidences of in-plane and out-of-plane Cu grain growth are observed resulting in a wiggling bonding interface. This gives rise to enhancement in shear strength in the bonded Cusingle bondCu layer. |
| บรรณานุกรม | : |
Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . (2554). Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . 2554. "Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . "Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2554. Print. Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2554.
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