| ชื่อเรื่อง | : | Self-assembled monolayers for reduced temperature direct metal thermocompression bonding. |
| นักวิจัย | : | Ang, X. F. , Li, F. Y. , Tan, W. L. , Chen, Z. , Wong, Chee C. , Wei, J. |
| คำค้น | : | DRNTU::Engineering::Materials. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2550 |
| อ้างอิง | : | Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, C. C. & Wei, J. (2007). Self-assembled monolayers for reduced temperature direct metal thermocompression bonding. Applied Physics Letters, 91(6). , http://hdl.handle.net/10220/7708 , http://dx.doi.org/10.1063/1.2768869 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Applied physics letters |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | A reduction in the bonding temperature required for direct gold-gold (Au–Au) thermocompression bonding is observed by coating a monolayer of dodecanethiol on gold surfaces prior to bonding. The results show that Au–Au bonded joints of 26.9 g per bump strength can be achieved at a temperature as low as 160 °C. The temperature drop becomes more apparent when both coated and blank gold samples are exposed in air over some time before bonding. The authors propose that self-assembled monolayers passivate metal surface by obviating the adsorption of surface contaminants, in particular, carbon and oxygen but get desorbed just before bonding takes place. |
| บรรณานุกรม | : |
Ang, X. F. , Li, F. Y. , Tan, W. L. , Chen, Z. , Wong, Chee C. , Wei, J. . (2550). Self-assembled monolayers for reduced temperature direct metal thermocompression bonding..
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Ang, X. F. , Li, F. Y. , Tan, W. L. , Chen, Z. , Wong, Chee C. , Wei, J. . 2550. "Self-assembled monolayers for reduced temperature direct metal thermocompression bonding.".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Ang, X. F. , Li, F. Y. , Tan, W. L. , Chen, Z. , Wong, Chee C. , Wei, J. . "Self-assembled monolayers for reduced temperature direct metal thermocompression bonding.."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2550. Print. Ang, X. F. , Li, F. Y. , Tan, W. L. , Chen, Z. , Wong, Chee C. , Wei, J. . Self-assembled monolayers for reduced temperature direct metal thermocompression bonding.. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2550.
|
ridm@nrct.go.th ระบบคลังข้อมูลงานวิจัยไทย รายการโปรดที่คุณเลือกไว้
