An experiment has been performed to investigate the cooling performance of a thermoelectric ceiling cooling panel (TECCP). The TE-CCP was composed of 36 TE modules. The cold side of the TE modules was fixed to an aluminum ceiling panel to cool a test chamber of 4.5 m³ volume, while a copper heat exchanger with circulating cooling water at the hot side of the TE modules was used for heat release. Tests were conducted using various system parameters. It was found that the cooling performance of the system depended on the electrical supply, cooling water temperature and flow rate through the heat exchanger. A suitable condition occurred at 1.5 A of current flow with a corresponding cooling capacity of 289.4 W which gives the coefficient of performance (COP) of 0.75 with an average indoor temperature of 27°C. Using thermal comfort test data in literature for small air movements under radiant cooling ceilings, results from the experiments show that thermal comfort could be obtained with the TE-CCP system. Copyright