| ชื่อเรื่อง | : | Laser focus depth adaptation for decapsulation of copper wirebonded devices |
| นักวิจัย | : | Kor, Katherine Hwee Boon , Liu, Qing , Siah, Yu Wen , Gan, Chee Lip |
| คำค้น | : | DRNTU::Engineering::Materials::Metallic materials |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2557 |
| อ้างอิง | : | Kor, H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2014). Laser focus depth adaptation for decapsulation of copper wirebonded devices. Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 94-99. , http://hdl.handle.net/10220/25336 , 184396 , http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=%2Fasset_publisher%2Fview_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical decapsulation. Thin quad flat packages (TQFPs) of dimensions 22 mm × 22 mm, with copper wirebonds were pre-laser decapped (Nd:YAG laser, 1064 nm) at three depths of focus, at focus, (z-0.5) mm and (z-1) mm. Reducing the laser focus depth by 1 mm, followed by subsequent chemical decapsulation, resulted in the least damage to copper wirebonds. Average percentage reduction in copper wirebond diameter after complete (laser and chemical) decapsulation is about 2.30%. |
| บรรณานุกรม | : |
Kor, Katherine Hwee Boon , Liu, Qing , Siah, Yu Wen , Gan, Chee Lip . (2557). Laser focus depth adaptation for decapsulation of copper wirebonded devices.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Kor, Katherine Hwee Boon , Liu, Qing , Siah, Yu Wen , Gan, Chee Lip . 2557. "Laser focus depth adaptation for decapsulation of copper wirebonded devices".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Kor, Katherine Hwee Boon , Liu, Qing , Siah, Yu Wen , Gan, Chee Lip . "Laser focus depth adaptation for decapsulation of copper wirebonded devices."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2557. Print. Kor, Katherine Hwee Boon , Liu, Qing , Siah, Yu Wen , Gan, Chee Lip . Laser focus depth adaptation for decapsulation of copper wirebonded devices. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2557.
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