| ชื่อเรื่อง | : | Investigation of cure stresses in non-conductive adhesive interconnects |
| นักวิจัย | : | Yu, Hong |
| คำค้น | : | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2550 |
| อ้างอิง | : | Yu,H. (2007). Investigation of cure stresses in non-conductive adhesive interconnects. Doctoral thesis, Nanyang Technological University, Singapore. , http://hdl.handle.net/10356/35960 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Non-conductive adhesives (NCAs) offer cost reduction, simplicity, and flexibility over other electrically conductive adhesives (ECAs) due to an absence of conductive fillers and reduced processing requirements. However, although NCAs are a very promising potential alternative to metallic solder interconnections, there continue to be significant challenges that need to be addressed for their widespread implementation. This investigation focuses on a fundamental study of the mechanical, thermal and rheological properties of NCAs during cure process, the formation of the electrical connectivity, and the mechanisms governing long-term reliability of NCA flip chip interconnects. 187 p. |
| บรรณานุกรม | : |
Yu, Hong . (2550). Investigation of cure stresses in non-conductive adhesive interconnects.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Yu, Hong . 2550. "Investigation of cure stresses in non-conductive adhesive interconnects".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Yu, Hong . "Investigation of cure stresses in non-conductive adhesive interconnects."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2550. Print. Yu, Hong . Investigation of cure stresses in non-conductive adhesive interconnects. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2550.
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