| ชื่อเรื่อง | : | Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength |
| นักวิจัย | : | Aditya Kumar |
| คำค้น | : | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2550 |
| อ้างอิง | : | Aditya, K. (2007). Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength. Doctoral thesis, Nanyang Technological University, Singapore. , http://hdl.handle.net/10356/5119 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P concentration of Ni-P, and electric current density were varied systematically and their effect was studied on the solder joint strength. |
| บรรณานุกรม | : |
Aditya Kumar . (2550). Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Aditya Kumar . 2550. "Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Aditya Kumar . "Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2550. Print. Aditya Kumar . Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2550.
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