| ชื่อเรื่อง | : | Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards. |
| นักวิจัย | : | Wang, Yuqi. |
| คำค้น | : | DRNTU::Engineering::Manufacturing::Product engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2551 |
| อ้างอิง | : | Wang, Y. (2008). Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards. Doctoral thesis, Nanyang Technological University, Singapore. , http://hdl.handle.net/10356/5368 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products. |
| บรรณานุกรม | : |
Wang, Yuqi. . (2551). Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards..
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Wang, Yuqi. . 2551. "Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards.".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Wang, Yuqi. . "Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards.."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2551. Print. Wang, Yuqi. . Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards.. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2551.
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