| ชื่อเรื่อง | : | Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding |
| นักวิจัย | : | Tan, Cher Ming , Yu, Weibo , Wei, Jun |
| คำค้น | : | DRNTU::Engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2549 |
| อ้างอิง | : | Tan, C. M., Yu, W., & Wei, J. (2006). Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding. Applied Physics Letters, 88(11), 114102. , 0003-6951 , http://hdl.handle.net/10220/17368 , http://dx.doi.org/10.1063/1.2185467 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Applied physics letters |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Two low-temperature wafer bonding methods, namely the medium-vacuum level wafer bonding (MVWB) and plasma-activated wafer bonding (PAWB), are performed. After low-temperature annealing(500°C) for a short time (<5h) , the bond strength of these two low-temperature methods is improved as compared to the conventional air wafer bonding. The bond efficiency of MVWB is found to be better than the conventional air wafer bonding, but PAWB contains more bubbles. The qualitative mechanisms of these two low-temperature wafer bonding methods are proposed. |
| บรรณานุกรม | : |
Tan, Cher Ming , Yu, Weibo , Wei, Jun . (2549). Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Cher Ming , Yu, Weibo , Wei, Jun . 2549. "Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Cher Ming , Yu, Weibo , Wei, Jun . "Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2549. Print. Tan, Cher Ming , Yu, Weibo , Wei, Jun . Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2549.
|
