| ชื่อเรื่อง | : | Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking |
| นักวิจัย | : | Peng, L. , Fan, Ji , Zhang, L. , Li, H. Y. , Lim, Dau Fatt , Tan, Chuan Seng |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2555 |
| อ้างอิง | : | Peng, L., Fan, J., Zhang, L., Li, H. Y., Lim, D. F., & Tan, C. S. (2012). Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking. 2012 IEEE International Interconnect Technology Conference (IITC). , http://hdl.handle.net/10220/12069 , http://dx.doi.org/10.1109/IITC.2012.6251659 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | In this paper, we successfully demonstrate ultrahigh density (>; 10^6 cm^-2) Cu-Cu interconnects of 6-μm pitch using wafer-on-wafer thermo-compression bonding. This is a significant improvement from our previous achievement of 15-μm pitch. In addition, we integrate Cu sealing frame with excellent helium leak rate to the bonded structures to promote the overall bond reliability. On top of that, temporary passivation of Cu surface using self-assembled monolayer (SAM) enhances the resistance against oxidation and particle contamination. Finally, thermal cycling test confirmed the thermal stability of the Cu-Cu daisy chain structure up to 1,000 cycles. Hence, this work opens up new opportunity for wafer level integration of Cu-Cu bonding with state-of-the-art TSV technology, enabling future ultrahigh density 3D IC applications. |
| บรรณานุกรม | : |
Peng, L. , Fan, Ji , Zhang, L. , Li, H. Y. , Lim, Dau Fatt , Tan, Chuan Seng . (2555). Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Peng, L. , Fan, Ji , Zhang, L. , Li, H. Y. , Lim, Dau Fatt , Tan, Chuan Seng . 2555. "Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Peng, L. , Fan, Ji , Zhang, L. , Li, H. Y. , Lim, Dau Fatt , Tan, Chuan Seng . "Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2555. Print. Peng, L. , Fan, Ji , Zhang, L. , Li, H. Y. , Lim, Dau Fatt , Tan, Chuan Seng . Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2555.
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