This paper describes the application of lensless in-line digital holographic microscopy (DHM) to carry out thermo-mechanical characterization of microheaters fabricated through PolyMUMPs three-layer polysilicon surface micromachining process and subjected to a high thermal load. The mechanical deformation of the microheaters on the electrothermal excitation due to thermal stress is analyzed. The numerically reconstructed holographic images of the microheaters clearly indicate the regions under high stress. A double-exposure method has been used to obtain the quantitative measurements of the deformations, from the phase analysis of the hologram fringes. The measured deformations correlate well with the theoretical values predicted by a thermo-mechanical analytical model. The results show that lensless in-line DHM with Fourier analysis is an effective method for evaluating the thermo-mechanical characteristics of MEMS components.