| ชื่อเรื่อง | : | Effect of BOE etching time on wire bonding quality |
| นักวิจัย | : | Tan, Cher Ming , Linggajaya, Kaufik , Er, Eddie , Chai, Vincent Siew Heong |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2542 |
| อ้างอิง | : | Tan, C. M., Linggajaya, K., Er, E., & Chai, V. S. H. (1999). Effect of BOE etching time on wire bonding quality. IEEE Transactions on Components and Packaging Technology, 22(4), 551-557. , 1521-3331 , http://hdl.handle.net/10220/4637 , http://dx.doi.org/10.1109/6144.814971 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | IEEE transactions on components and packaging technology |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | The dependence of wire bond-pull strength on the morphology of the underlying polycrystalline silicon (poly-Si) beneath the bondpad metal is studied using atomic force microscopy(AFM). Statistical analysis shows that the roughness of the poly-Si is correlated with the wire bond-pull strength. The correlation is believed to be due to the effectiveness of thermal dissipation through poly-Si during the wire bonding process. Statistical analysis also shows that the roughness of the poly-Si is correlated to the buffered oxide etch (BOE) etching time before the bondpad metal deposition. In this work, it is concluded that the BOE etching time has a significant effect on the wire bonding quality. The roughness parameter that links the BOE etching time to the wire bond-pull strength is found to be the localization factor. |
| บรรณานุกรม | : |
Tan, Cher Ming , Linggajaya, Kaufik , Er, Eddie , Chai, Vincent Siew Heong . (2542). Effect of BOE etching time on wire bonding quality.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Cher Ming , Linggajaya, Kaufik , Er, Eddie , Chai, Vincent Siew Heong . 2542. "Effect of BOE etching time on wire bonding quality".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tan, Cher Ming , Linggajaya, Kaufik , Er, Eddie , Chai, Vincent Siew Heong . "Effect of BOE etching time on wire bonding quality."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2542. Print. Tan, Cher Ming , Linggajaya, Kaufik , Er, Eddie , Chai, Vincent Siew Heong . Effect of BOE etching time on wire bonding quality. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2542.
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