| ชื่อเรื่อง | : | Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis |
| นักวิจัย | : | Abdul Aziz, M. S. , Abdullah, M. Z. , Khor, C. Y. |
| คำค้น | : | TJ1-1570 Mechanical engineering and machinery |
| หน่วยงาน | : | Universiti Sains Malaysia, Malaysia |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2557 |
| อ้างอิง | : | http://eprints.usm.my/38922/1/Effects_of_Solder_Temperature_on_Pin_Through%2DHole_during_Wave_Soldering_Thermal%2DFluid.pdf , Abdul Aziz, M. S. and Abdullah, M. Z. and Khor, C. Y. (2014) Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis. Scientific World Journal, 2014 (482363). pp. 1-13. ISSN 2356-6140 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | http://dx.doi.org/10.1155/2014/482363 , http://eprints.usm.my/38922/ |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183∘C) < |
| บรรณานุกรม | : |
Abdul Aziz, M. S. , Abdullah, M. Z. , Khor, C. Y. . (2557). Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis.
กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia. Abdul Aziz, M. S. , Abdullah, M. Z. , Khor, C. Y. . 2557. "Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis".
กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia. Abdul Aziz, M. S. , Abdullah, M. Z. , Khor, C. Y. . "Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis."
กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia, 2557. Print. Abdul Aziz, M. S. , Abdullah, M. Z. , Khor, C. Y. . Effects of Solder Temperature on Pin Through-Hole during
Wave Soldering: Thermal-Fluid Structure Interaction Analysis. กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia; 2557.
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