| ชื่อเรื่อง | : | Transient liquid phase Ag-based solder technology for high-temperature packaging applications |
| นักวิจัย | : | Sharif, Ahmed , Gan, Chee Lip , Chen, Zhong |
| คำค้น | : | DRNTU::Engineering::Materials::Metallic materials::Alloys |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2556 |
| อ้างอิง | : | Sharif, A., Gan, C. L., & Chen, Z. (2014). Transient liquid phase Ag-based solder technology for high-temperature packaging applications. Journal of alloys and compounds, 587, 365-368. , 0925-8388 , http://hdl.handle.net/10220/24294 , http://dx.doi.org/10.1016/j.jallcom.2013.10.204 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Journal of alloys and compounds |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded at 250 °C for 10 minutes. The study focuses on mechanical and microstructural characterizations of the joints. The shear strength measured at 250 °C shows good high temperature performance of the joint. The effects of Ag and Sn contents on mechanical, electrical and thermal properties of sintered bulk Ag–Sn samples were also investigated independently. The results demonstrate that the Ag–Sn TLP bonding is an effective interconnection method for harsh environment electronic packaging. |
| บรรณานุกรม | : |
Sharif, Ahmed , Gan, Chee Lip , Chen, Zhong . (2556). Transient liquid phase Ag-based solder technology for high-temperature packaging applications.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Sharif, Ahmed , Gan, Chee Lip , Chen, Zhong . 2556. "Transient liquid phase Ag-based solder technology for high-temperature packaging applications".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Sharif, Ahmed , Gan, Chee Lip , Chen, Zhong . "Transient liquid phase Ag-based solder technology for high-temperature packaging applications."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2556. Print. Sharif, Ahmed , Gan, Chee Lip , Chen, Zhong . Transient liquid phase Ag-based solder technology for high-temperature packaging applications. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2556.
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