| ชื่อเรื่อง | : | Package and board level reliability modeling of advanced CSP pakages for telecommunication applications. |
| นักวิจัย | : | Tee, Tong Yan. |
| คำค้น | : | DRNTU::Engineering::Manufacturing::Product engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2548 |
| อ้างอิง | : | Tee, T. Y. (2005). Package and board level reliability modeling of advanced CSP pakages for telecommunication applications. Doctoral thesis, Nanyang Technological University, Singapore. , http://hdl.handle.net/10356/6512 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Market for telecommunication products (e.g., mobile phones) is very competitive, demanding products which are more reliable, higher performance, lighter, smaller, cheaper, and shorter time-to-market. These technology requirements are possible with the recent development of advanced Chip Scale Packages (CSPs), such as thin-profile fine-pitch Ball Grid Array (TFBGA), Quad-Flat-No-lead (QFN), and wafer-level CSP (WL-CSP). However, due to limited product development time, these CSPs are usually not tested and studied in detail before introduction to the market. As a result, the package design may not be optimized for various reliability requirements, e.g., popcorn, thermal cycling test, and drop test. |
| บรรณานุกรม | : |
Tee, Tong Yan. . (2548). Package and board level reliability modeling of advanced CSP pakages for telecommunication applications..
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tee, Tong Yan. . 2548. "Package and board level reliability modeling of advanced CSP pakages for telecommunication applications.".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Tee, Tong Yan. . "Package and board level reliability modeling of advanced CSP pakages for telecommunication applications.."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2548. Print. Tee, Tong Yan. . Package and board level reliability modeling of advanced CSP pakages for telecommunication applications.. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2548.
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