| ชื่อเรื่อง | : | Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking |
| นักวิจัย | : | Peng, L. , Fan, Ji , Li, H. Y. , Gao, Shan , Tan, Chuan Seng |
| คำค้น | : | DRNTU::Engineering::Electrical and electronic engineering. |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2555 |
| อ้างอิง | : | Peng, L., Fan, J., Li, H. Y., Gao, S., & Tan, C. S. (2012). Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less cu-cu bonding for 3D wafer stacking. 2012 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 1-2. , http://hdl.handle.net/10220/17047 , http://dx.doi.org/10.1109/VLSI-TSA.2012.6210174 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | - |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Wafer-on-wafer stacking is demonstrated successfully using bump-less Cu-Cu bonding for simultaneous formation of electrical connection, mechanical support and hermetic seal. The mechanical strength of the bonded Cu-Cu layer sustains grinding and chemical etching. Daisy chain of at least 44,000 contacts at 15μm pitch is connected successfully. Cu-Cu hermetic seal ring shows helium leak rate >;10X lower than the reject limit without under-fill. This provides robust IC-to-IC connection density of 4.4 × 105 cm-2 suitable for future wafer level 3D integration. |
| บรรณานุกรม | : |
Peng, L. , Fan, Ji , Li, H. Y. , Gao, Shan , Tan, Chuan Seng . (2555). Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Peng, L. , Fan, Ji , Li, H. Y. , Gao, Shan , Tan, Chuan Seng . 2555. "Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Peng, L. , Fan, Ji , Li, H. Y. , Gao, Shan , Tan, Chuan Seng . "Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2555. Print. Peng, L. , Fan, Ji , Li, H. Y. , Gao, Shan , Tan, Chuan Seng . Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2555.
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