| ชื่อเรื่อง | : | Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications |
| นักวิจัย | : | Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo |
| คำค้น | : | DRNTU::Engineering::Materials::Electronic packaging materials , DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films |
| หน่วยงาน | : | Nanyang Technological University, Singapore |
| ผู้ร่วมงาน | : | - |
| ปีพิมพ์ | : | 2552 |
| อ้างอิง | : | Made, R. I., Gan, C. L., Yan, L. L., Yu, A., Yoon, S. W., Lau, J. H., et al. (2009). Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications. Journal of Electronic Materials, 38, 365-371. , 0361-5235 , http://hdl.handle.net/10220/7261 , http://dx.doi.org/10.1007/s11664-008-0555-8 , 142282 |
| ที่มา | : | - |
| ความเชี่ยวชาญ | : | - |
| ความสัมพันธ์ | : | Journal of electronic materials |
| ขอบเขตของเนื้อหา | : | - |
| บทคัดย่อ/คำอธิบาย | : | Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400 C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180 C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints. |
| บรรณานุกรม | : |
Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . (2552). Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . 2552. "Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications".
กรุงเทพมหานคร : Nanyang Technological University, Singapore. Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . "Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications."
กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2552. Print. Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2552.
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