The sputtering process are the method which uses to deposits substrate in vacuum by discharging deposited particle, by colliding with higher energy particle in the form of a single atom and depositing target. In this research, using thin films of titaniumnitride, golden-colored ceramics compound, which is durable, resistant to corrosion and has many application uses. This research also study the optimum gas pressure which is suitible for desposition of titaniumnitride in sputtering DC. planar magnetron. From the experiment, we found that when changing factors in the sputtering processes the color of titaniumnitride has been deferent too are found that changing the sputtering factors changes the color of titaniumnitride result of changing color of deposited films due changing of pressure of Nitrogen and Argon was also studies in order to get the optimum value for making films with most practical use.